“All ideas are good ideas, and none are too small.”
Wet Etching, Photo Chemical Machining & Micro Milling
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ITAR Registered | ISO 9001:2015
E-Fab manufactures parts from thin metal sheets of alloys including, Aluminum, Copper, and Titanium; they also work with flex substrates, advanced PCB materials, and high-frequency laminates. These parts are used in simple to complex applications by high-tech OEMs on the leading edge of new products and designs.
Stiffeners & Busbars: Customizable pins, spacing, height and length, surface holes or slots, top and end tabs
Mesh Screens: Simple Filters, Sieves, PCB Ventilated Shields, EMI and RFI Shields, Particle Filters. Hexagonal or Round Screen Mesh
Micro Bumps: Formed protrusions also called Micro Divets. Miniature Switch Contacts, IC Test Socket Contacts, Formed Spring Contacts, Electrically Isolated Test Pins
Microwave & RF Circuits: Flex Circuits, Sculptured Flex Circuits, PCB Flex Circuits, Heavy Metal Flex Circuits
Custom Etched Parts: Antennas, Carriers, Contacts, Encoders, Gaskets, Leadframes, Shields, Shims, Step Lids, Surgical Blades, Washers
E-Fab uses photochemical machining to produce a wide range of precision thin metal components for use across a diverse set of industries. The process allows us to create parts with complex or intricate geometries to tight tolerances at competitive prices.
Barrel plating occurs inside of a polypropylene barrel with bars running through the center to conduct electrical currents. This barrel is rotated with a part inside of it, causing the part to tumble through an electrolytic solution. This results in a uniform finish on the workpiece.
In rack plating, parts are attached to metal racks and remain stationary as they’re immersed in a plating solution. This is ideal for less durable parts that may not be able to withstand the tumbling associated with barrel plating.
The Military, Automotive, and Medical industries often rely on this style of plating for important parts and components.
Dielectric coatings work by reflecting the interference from multiple interfaces away from sensitive electronic components.
Designing dielectric coatings involves a choice of one or two materials and consideration of the necessary layers and their thickness values. Our process can be used to apply a single layer of thin-film coating or several layers, depending on project requirements.
The process for EMI and RFI shields is done when components are in panel form. That way, coating materials do not fill or mar bend lines. This permits a low-profile shield design, which is useful in many small electronic parts.
Our system yields Hi-Pot tests up to five times higher than powder coating when tested on PCBs and thin metal parts. Our dielectric coatings meet Hi-Pot 800 volt standards and we triple the thickness to allow approximately 2000 volts. Quality control ensures uniform thickness of applied coatings and strong adhesion and durability.
Technological advancements have led to the development of manual and automated tools that can perform almost any metal forming operation. Once the forming operations are complete, excess metal simply needs to be sheared off to reveal the completed workpiece.
The cutting stage of production may involve any number of specialized processes. Dependent on application needs, a sheet may be:
In addition to our expertise in photochemical etching, E-Fab specializes in flex circuitry. Our team of experienced engineers design and build flex and thin metal circuits for use in applications around the world.
We use a wide variety of production methods, including photochemical machining (PCM), heat bonding, and machining to produce high-quality circuits and electronic parts.
Through a combination of pressure and heat, also called Thermocompression Bonding, we use a hydraulic heat press to compress lamination layers together. This process can laminate PCBs, flex circuits, and more.
E-Fab builds these parts and more for industries including Automotive, Communications, Electronics, Electrical Machinery, Medical technology, Military and Defense, and Semiconductor. We also create parts that aid in EMI and RF shielding.
Our team can encapsulate parts with basic materials and hard insulation materials for multiple layers of stiffness. Electronics are continuing to face demands for smaller systems and more flexible circuitry, especially as equipment across multiple industries incorporates touchscreen technologies and continuous monitoring. Our manufacturing processes are built to help your company meet this demand.
TMM® thermoset microwave laminates from Rogers Corporation possess mechanical and electrical stability, copper matched coefficient of thermal expansion, low thermal coefficient of dielectric constant, and dielectric constant uniformity. These features provide ultimate reliability in micro-strip and strip-line applications. TMM laminates offer key fabrication benefits over alumina substrates since they are available in larger, copper-clad formats, which facilitates the use of standard printed circuit board (PCB) subtractive processes.
Fabricated from woven lightweight fiberglass, Taconic TLY laminates feature increased dimensional stability when compared to PTFE fiber-reinforced composites. The mechanical stability of this laminate makes it an ideal choice for high-volume production. A low dissipation factor supports antennas in millimeter wave frequencies and automotive radar equipment operating at 77 GHz.
We specialize in creating laminate and prepreg materials for the kind of technology that all of us use every day, all over the world. ~ Isola Group
We also can handle deburring, chamfering, and thru-hole plating. If we can’t do it in-house, we have established relationships with a reputable network of suppliers.
High reliability flex and multilayer flex circuitry
3D Antenna Housings
Antennas (Polarized & Wave)
Alignment Shims
EMI | RMI Shielding
Guage Needles
Ground Radar
Micro Bumps
On Board Computuer Stiffeners
Antennas
Antenna Elements and Arrays
EMI Shielding
Micro Contacts
Micro Bumps
Microwave Circuit Components
PCB Stiffeners & Jumpers
Sculpted Flex Circuits
Busbars
Flex Circuits
Stiffeners
Fuel Cell Screens | Frames | End Caps
Flat Springs
Electrical Contacts
Heat Exchanger Plates
Speaker Grills
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